Recent Publications

[1]. K. H. Kim and J. E. Schutt-Aine, "Design of Power Distribution Networks with VHF-Band Cut-Off Frequency and Small Unit Cell Size for Mixed-Signal Systems," IEEE Microwave and Wireless Components Letters, vol. 17, pp. 489-491, July 2007.

[2]. K. H. Kim and J. E. Schutt-Aine, "Analysis and Modeling of Hybrid Planar-Type Electromagnetic-Bandgap Structures and Feasibility Study on Power Distribution Network Applications," IEEE Trans. Microwave Theory Tech., vol. 56, pp. 178-186, January 2008.

[3]. P. Goh, J. E. Schutt-Aine, D. Klokotov, Jilin Tan, Ping Liu, Wenliang Dai, F. Al-Hawari, F., "Partitioned Latency Insertion Method With a Generalized Stability Criteria,"IEEE Trans. Comp. Packaging. Manuf. Tech., vol. 1, pp. 1447-1455, October 2011.

[4]. J. E. Schutt-Aine, P. Goh, Y. Mekonnen, Jilin Tan, F. Al-Hawari, Ping Liu; Wenliang Dai, "Comparative Study of Convolution and Order Reduction Techniques for Blackbox Macromodeling Using Scattering Parameters," IEEE Trans. Comp. Packaging. Manuf. Tech., vol. 1, pp. 1642-1650, October 2011.

[5]. D. Klokotov, P. Goh,and J.E. Schutt-Aine, J. E., "Latency Insertion Method (LIM) for DC Analysis of Power Supply Networks", IEEE Trans. Comp. Packaging. Manuf. Tech., vol. 1, pp. 1839-1845, November 2011.

[6]. Y. Mekonnen and J. Schutt-Aine, "Broadband Macromodeling of Sampled Frequency data using z-domain Vector Fitting Method," Proceedings of the 11th IEEE Workshop Workshop on Signal Propagation in Interconnects, SPIE, Genoa, Italy, May 2007.

[7]. Y. Mekonnen and J. Schutt-Ainé, "Fast Macromodeling Technique of Sampled Time/Frequency Data Using z-domain Vector-Fitting Method," Proceedings of the 16th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Atlanta, GA, October 2007.

[8]. J. Schutt-Ainé, "LIM Based Algorithm for the Transient Simulation of Large Networks," ," Proceedings of the 16th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Atlanta, GA, October 2007.

[9]. Ki Hyuk Kim, Pavle Milosevic, and José E. Schutt-Ainé, "Cut-off Frequency Enhanced Hybrid Electromagnetic Bandgap (EBG) Structures with Wideband Noise Suppression Characteristics" , 2007 IEEE-APS, pp. 2913-2916.

[10]. José Schutt-Ainé, Jilin. Tan, C. Kumar, and Feras. Al-Hawari, "Blackbox Macromodel with S-Parameters and Fast Convolution", Proceedings of the 2008 IEEE Workshop on Signal Propagation in Interconnects, SPIE, Avignon, France, May 2008.

[11]. Yidnek S. Mekonnen and Jose E. Schutt-Aine, "Fast Broadband Macromodeling Technique of Sampled Time/Frequency Data using z-domainVector-fitting Method", Proceedings of 48th IEEE Electronic Components and Technology Conference (ECTC), Lake Buena Vista, May 2008.

[12]. Dmitri Klokotov, and José Schutt-Ainé, “Transient Simulation of Lossy Interconnects using the Latency Insertion Method (LIM)”, Proceedings of the 17th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), pp. 251-254, San Jose, CA, October 2008.

[13]. Pavle Milosevic and J. E. Schutt-Ainé, “On-chip Oscilloscope for Signal Integrity Characterization of Interconnects in 130nm CMOS Technology”, Proceedings of the 17th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), pp. 65-68, San Jose, CA, October 2008.

[14]. José Schutt-Ainé, "Stability Analysis of the Latency Insertion Method Using a Block Matrix Formulation", Proceedings of EDAPS-08, Seoul, South Korea, December 2008.

[15]. Dmitri Klokotov, and José Schutt-Ainé, "Latency Insertion Method for the Analysis of Steady State On-Chip Power Distribution Networks and Transient Simulation of Lossy Interconnects", Proceedings of APMC-2008, Hong Kong, December 2008.

[16]. D. Klokotov and J. Schutt-Aine, "Extensions of the Latency Insertion Method (LIM) to DC analysis of power supply networks and modeling of circuit interconnects with frequency-dependent parameters," Proceedings of the 59th Electronic Components and Technology Conference (ECTC), San Diego, CA, pp. 1624-1629.

[17]. J. Schutt-Aine, "Stability analysis for semi-implicit LIM algorithm," Proceedings of the Asia Pacific Microwave Conference, APMC 2009 pp. 1270 - 1272.

[18]. P. Milosevic, J. E. Schutt-Aine, N.R. Shanbhag, "DSP-based multimode signaling for FEXT reduction in multi-Gbps links Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on pp. 45 - 48.

[19]. J. Schutt-Aine, D. Klokotov, P. Goh, Jilin Tan, F. Al-Hawari, Ping Liu, Wenliang Dai, "Application of the latency insertion method to circuits with blackbox macromodel representation," Proceedings of the 11th Electronics Packaging Technology Conference (EPTC), pp. 92-95, Singapore, December 2009.

[20]. D. Klokotov, V. Shukla, J. Schutt-Ainé and E. Rosenbaum, "Application of the Latency Insertion Method (LIM) to the Modeling of CDM ESD Events," ", Proceedings of 50th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, June 2010.

[21]. J. Schutt-Aine, P. Milosevic and W. Beyene, “Modeling and Simulation of High Speed I/O Links Using X Parameters," Proceedings of the 19th Topical Meeting on Electrical Performance of Electronic Packaging (EPEPS-2010), Austin, TX, October 2010.

[22]. P. Milosevic, J. E. Schutt-Ainé, W. Beyene, "Crosstalk Mitigation of High-Speed Interconnects with Discontinuities Using Modal Signaling", Proceedings of the 19th Topical Meeting on Electrical Performance of Electronic Packages (EPEPS-2010), Austin, TX, October 2010.

[23]. J. Schutt-Aine, P. Milosevic, W. Beyene, “Modeling of I/O Links Using X Parameters”, Designcon 2011.

[24]. P. Goh, J. E. Schutt-Ainé, D. Klokotov, J. Tan, P. Liu, W. Dai, and F. Al-Hawari, "Partitioned Latency Insertion Method (PLIM) with Stability Considerations," Proceedings of the 2011 IEEE Workshop on Signal Propagation on Interconnects, SPIE, Naples, Italy, May 2011.

[25]. P. Goh, and J. E. Schutt-Aine, "Latency Insertion Method (LIM) for CMOS Circuit Simulations with Multi-rate Considerations", Proceedings of the 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS-2011), pp. 125-128, San Jose, CA, October 2011.

[26]. P. Milosevic and J. E. Schutt-Aine, "Design of a 12Gb/s Transceiver for High-Density Links with Discontinuities Using Modal Signaling,"Proceedings of the 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS-2011), pp. 215-218, San Jose, CA, October 2011.

[27]. D. Klokotov, J. Schutt-Aine, W. Beyene, D. Mullen, M. Li, R. Schmitt and L. Yang, " Application of the Latency Insertion Method to Electro-Thermal Circuit Analysis,"Proceedings of the 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS-2011), pp. 263-2266, San Jose, CA, October 2011.

[28]. P. Liu, J. Tan, Z. Zhou, J. Schutt-Aine, and P. Goh, " A Comparison of Two Latency Insertion Methods in Dependent Sources Applications," Proceedings of the 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS-2011), pp. 295-298, San Jose, CA, October 2011.

[29]. Pavle Milosevic and José E. Schutt-Ainé "System-Level Characterization of Modal Signaling for High-Density Off-Chip Interconnects," to be presented at EDAPS-2011, Shanghai, China, December 2011.


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