Index of /epeps/T-IV

	Name	Last modified	Size	Description
	Parent Directory		-
	T_IV_1Modeling and Analysis of Simultaneous Switching Noise for Full Wafer Scale Chip Core.pdf	2023-12-22 11:13	284K
	T_IV_2Design and Analysis of Redistribution Layer Interposer Channel Considering Signal Integrity for High Bandwidth Module.pdf	2023-12-22 11:13	750K
	T_IV_3Real-Time Precision Prediction of 3-D Package Thermal Maps via Image-to-Image Translation.pdf	2023-12-22 11:13	5.4M
	T_IV_4Design and Analysis of an Irregular-Shaped Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer.pdf	2023-12-22 11:13	1.3M
	T_IV_5HBM3 PPA Performance Evaluation by TSV Model with Micro-Bump and Hybrid Bonding.pdf	2023-12-22 11:13	561K