Index of /epeps/M-II
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M_II_1Analyses of Via-In-Pad Plated Over (VIPPO) and Dogbone in Fanout Routing High-Density Interconnects.pdf
2023-12-22 11:13
1.4M
M_II_2A New Perspective on Quasi-TEM Behavior in Microstrip Transmission Lines.pdf
2023-12-22 11:13
2.1M
M_II_3Interconnect Modelling Sensitivity Studies for High Signaling Data Rates.pdf
2023-12-22 11:13
750K
M_II_4Package Technology Enabling for 224 Gbps Electrical Signaling.pdf
2023-12-22 11:13
497K
M_II_5Analysis of Differential Stripline Routing Approaches within a PCB Via Field for Crosstalk Mitigation.pdf
2023-12-22 11:13
1.0M
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